Microelectronic Wiley sol 다운받기
Microelectronic Wiley sol 다운받기
Microelectronic Wiley sol
John Wiley & Sons (Asia) Pte.
Foreword by C. P. Wong xiii
Foreword by Zhigang Suo xv Preface xvii Acknowledgments xix About the Authors xxi Part I Mechanics and Modeling 1 1 Constitutive Models and Finite Element Method 3 1.1 Constitutive Models for Typical Materials 3 1.1.1 Linear Elasticity 3 1.1.2 Elastic-Visco-Plasticity 5 1.2 Finite Element Method 9 1.2.1 Basic Finite Element Equations 9 1.2.2 Nonlinear Solution Methods 12 1.2.3 Advanced Modeling Techniques in Finite Element Analysis 14 1.2.4 Finite Element Applications in Semiconductor Packaging Modeling 17 1.3 Chapter Summary 18 References 19 2 Material and Structural Testing for Small Samples 21 2.1 Material Testing for Solder Joints 21 2.1.1 Specimens 21 2.1.2 A Thermo-Mechanical Fatigue Tester 23 2.1.3 Tensile Test 24 2.1.4 Creep Test 26 2.1.5 Fatigue Test 31 2.2 Scale Effect of Packaging Materials 32 2.2.1 Specimens 33 2.2.2 Experimental Results and Discussions 34 2.2.3 Thin Film Scale Dependence for Polymer Thin Films 39 2.3 Two-Ball Joint Specimen Fatigue Testing 41 2.4 Chapter Summary 41 References 43 3 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution 45 3.1 Constitutive Model for Tin-Lead Solder Joi...(하략)
자료출처 : http://www.ALLReport.co.kr/search/Detail.asp?pk=16219338&sid=knp868group1&key=
[문서정보]
문서분량 : 782 Page
파일종류 : ZIP 파일
자료제목 : Microelectronic Wiley sol
파일이름 : Microelectronic Wiley 2~9장 솔루션[2].zip
키워드 : Microelectronic,Wiley,2~9장,저자,John,&,Sons,Asia,Pte,sol
자료No(pk) : 16219338
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Microelectronic Wiley sol
John Wiley & Sons (Asia) Pte.
Foreword by C. P. Wong xiii
Foreword by Zhigang Suo xv Preface xvii Acknowledgments xix About the Authors xxi Part I Mechanics and Modeling 1 1 Constitutive Models and Finite Element Method 3 1.1 Constitutive Models for Typical Materials 3 1.1.1 Linear Elasticity 3 1.1.2 Elastic-Visco-Plasticity 5 1.2 Finite Element Method 9 1.2.1 Basic Finite Element Equations 9 1.2.2 Nonlinear Solution Methods 12 1.2.3 Advanced Modeling Techniques in Finite Element Analysis 14 1.2.4 Finite Element Applications in Semiconductor Packaging Modeling 17 1.3 Chapter Summary 18 References 19 2 Material and Structural Testing for Small Samples 21 2.1 Material Testing for Solder Joints 21 2.1.1 Specimens 21 2.1.2 A Thermo-Mechanical Fatigue Tester 23 2.1.3 Tensile Test 24 2.1.4 Creep Test 26 2.1.5 Fatigue Test 31 2.2 Scale Effect of Packaging Materials 32 2.2.1 Specimens 33 2.2.2 Experimental Results and Discussions 34 2.2.3 Thin Film Scale Dependence for Polymer Thin Films 39 2.3 Two-Ball Joint Specimen Fatigue Testing 41 2.4 Chapter Summary 41 References 43 3 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution 45 3.1 Constitutive Model for Tin-Lead Solder Joi...(하략)
자료출처 : http://www.ALLReport.co.kr/search/Detail.asp?pk=16219338&sid=knp868group1&key=
[문서정보]
문서분량 : 782 Page
파일종류 : ZIP 파일
자료제목 : Microelectronic Wiley sol
파일이름 : Microelectronic Wiley 2~9장 솔루션[2].zip
키워드 : Microelectronic,Wiley,2~9장,저자,John,&,Sons,Asia,Pte,sol
자료No(pk) : 16219338
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